Semiconductor 3 giant to 18 inches wafer production in 2012
                                                                          Release time ：2008-05-08

   Although every 10 years a wafer generation transformation, already in 8 inches and 12-inch wafer in succession, but for verification on importing a next generation 18 inches wafer, but not really move. Late However, semiconductor industry 3 big giant Intel (Intel), samsung electronics (SamsungElectronics) and TSMC in eastern time 5 evening, said three giant together was agreed, mutual cooperation devoted to promoting a next generation wafer transformation, reservation 2012 import 18 inches wafer production.

The global semiconductor industry from past experience suggests, inducts the development wafer large size put into production, which can reduce each star grain (die) production cost, and 18 inches wafer surface area and cutting out the grain number, will be 12-inch wafer of more than two times, is expected to further reduce each star grain costs.

In addition to the cost of production consideration, import 18 inches wafer production, more can effectively use energy, water and other resources, from every single grain production process to see, large size wafer production to further reduce overall resource usage, also accord with current green tide. In fact, from 8 inches wafer turn into the 12-inch wafer production process devastates in a considerable degree to reduce semiconductor process as a result of air pollution, the greenhouse effect and water resource utilization, semiconductor companies now calls in green tide also expect import 18 inches wafer after, can further reduce these resources waste and pollution situation.

Samsung memory manufacturing center, senior vice President, said WooByun Cheong - turn into 18 inches wafer generation, will hopefully make overall IC industry ecosystem benefitted, Intel, samsung and TSMC will with suppliers and other semiconductor manufacturer cooperation, further active development 18 inches wafer production potential.

TSMC advanced science group of senior vice President MarkLiu noted, with advanced process technology brings the complexity thinking, has become the key semiconductor industry in the future, including Intel, samsung and TSMC all believe, turn into 18 inches wafer generation, when can provide for the field to maintain a reasonable cost solutions.